Based on fully self-developed tape casting and co-firing technology, the company has successfully developed high-quality HTCC green tape and matching pastes for building high-temperature co-fired ceramic circuits. Green tape is available in 6"/8" formats up to 450×450 mm, with a single-layer thickness of 50–500 μm after sintering (customisable) and Mylar film of 50/125 μm. Via-fill paste gives a minimum filled via diameter of 0.1 mm, solids content >88 wt% and fineness <10 μm. Wiring paste offers a printing resolution of 50 μm, fineness <5 μm, solids content of 85±3 wt% and sheet resistance <15 mΩ/□. Wall and solder-mask pastes offer a printing resolution of 0.1 mm and support both co-firing and post-firing.
