The 99.6% alumina ceramic substrate is produced by tape casting, microstructure design and high-temperature sintering. It features a smooth surface, high strength and ultra-low dielectric loss, offering a good balance between dielectric performance and mechanical strength, and is a mainstream substrate material for thin-film circuits, thick-film circuits and various sensors. Pre-drilling and annealing services are available; annealing effectively removes the damaged layer caused by laser drilling and helps customers improve downstream yield. Annual capacity is 5 million pieces, and thickness, outline dimensions and surface finish (as-fired, ground, polished) can all be customised.
