A lapping compound of synthetic diamond micro-powder in a dedicated carrier, supplied in oil-soluble and water-soluble versions, usually in grits from W0.5 to W40 and mixed to order, packed in syringes, tubes or pails. It is used for lapping and mirror polishing of carbide dies, gauges, optical glass, gemstones, ceramics and silicon wafers. Cutting power is strong and the grit distribution even, so workpieces are not easily scratched; diluted compound can be fed to lapping machines in circulation.
